Low Flux for Clean Soldering: The solder paste features a low flux formulation, known as RMA-223-UV, which results in minimal after use. This low- property reduces the amount of smoke generated during soldering, improves fluidity.
DISPOSABLE: RMA-223-UV, is a no-clean flux paste, the residue is very light in color, has a very high SIR value, and a special low-residue type that has less residue after use and does not need to be cleaned
RELIABLE QUALITY: no clean flux paste has instant wetting, excellent fluxing ability, no washing, strong viscosity, bright solder joints, less smoke, strong fluidity, low residue, more convenient to use
Application : The solder paste is suitable for the rework of mobile phone PCB, BGA and PGA and other SMDs. The soldering speed is fast, and the insulation value after the is cured is high. Therefore, it has little electrical interference to mobile phone and other communication products.
Versatile Design: The solder paste dispensing tool features an original structure with a detachable coil part and replaceable top accessories to achieve different functions. Utilizing a CPU radiator as the base, this tool offers excellent heat dissipation capabilities.
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